Electronic Materials, Components, Structural Parts

Shop Electronic Materials, Components, Structural Parts

Copper Clad Laminate (CCL)

Electronic Ceramic Material

Electronic Fine Chemical Material

Electronic Hardware Material

Electronic Magnetic Material (Electromagnet)

Piezoelectric Crystal Material

Semiconductor Material

Shielding Material

1,025 products

0.1MM FR-4 Copper Clad Laminate, Ultra-Thin Resin Fiberglass Double-Sided H/H, 12μm Copper Foil 1OZ, Guojie CCL

$0.45

10 Single/Double Sided Copper Clad Boards 10*15CM, Experiment Board/Universal Board/Fiberglass Material

$3.86

0.2mm Ultra-Thin FR4 Single-Sided Fiberglass Copper Clad Laminate Double-Sided H/H Manufacturer Processing Copper Foil 1OZ Unimicron Drilling and Forming

$0.45

0.5MM fiberglass copper-clad laminate single-sided 0.5OZ double-sided 35μm copper foil FR4 circuit board KB ITEQ CCL copper coating

$2.27

Metal tube shell QF224 QF227 QF253 QF255 QF263 QF320 series tube base housing

$0.23

Custom 2.0MM Copper Clad Laminate KB Single/Double Sided 1OZ Fiberglass Board CNC Custom Shape Teaching Test Cutting

$1.02

Fiberglass Copper Clad Laminate FR4 Single-Sided 1OZ Nanya Double-Sided 18μm Guojie Copper Clad Laminate Manufacturer Processing Custom Cutting

$2.27

Huanyu Chang's high-temperature resistant pressure pads provide uniform thermal conductivity for PCBs, FPCBs, aluminum substrates, copper clad laminates, and new energy applications.

$90.68

2.4MM Fiberglass Copper Clad Laminate Single-Sided 0.5OZ FR4 Circuit Board KB Lianmao CCL Copper Clad High TG

$68.18

Huanyuchang JSL400° Navis High-Temperature Buffer Pad PCB Aluminum Substrate Copper Clad Laminate IC Substrate New Energy

$90.68

Huanyuchang JSL400° Navis High-Temperature Lamination Buffer Material Copper Clad Laminate PCB New Energy HDI Specialized

$90.68

Huanyuchang KSL High-Temperature 260° Navis High-Temperature Lamination Buffer Pad Material New Energy CCL PCB

$90.68

KSL high-temperature resistant 260°C pressure-bonded cushioning material with uniform thermal conductivity for PCB aluminum substrates, copper-clad laminates, and CCL applications.

$90.68

Manufacturer KSL high-temperature resistant 260°C press-fit cushioning material with uniform thermal conductivity FPC CCL for new energy applications

$90.68

Source manufacturer JSL400° high temperature resistant lamination cushion pad for laminator PCB new energy CCL

$90.68

Huanyuchang Factory Direct MSL High-Temperature Lamination Buffer Pad for FPCB Aluminum Substrate Copper Clad Laminate New Energy

$90.68

Huanyuchang CSL High-Temperature 230° Navis Lamination Buffer Pad New Energy PCB Copper Clad Laminate CCL Specialized

$90.68

Source Manufacturer JSL Lamination High-Temperature Buffer Pad for PCB Aluminum Substrate Copper Clad Laminate Layer IC Substrate New Energy

$90.68

Factory direct sales of high-temperature resistant Navis press-fit cushioning pad material, uniform thermal conductivity PCB copper-clad laminate, new energy

$90.68

Source manufacturer DSL400° high temperature resistant cushion pad for laminator PCB new energy CCL copper clad laminate

$90.68

Huanyuchang GSL400° Navis High-Temperature Lamination Buffer Pad PCB New Energy CCL Copper Clad Laminate

$90.68

Source Manufacturer CSL Navis High-Temperature Lamination Material Specialized for CCL Copper Clad Laminate IC Substrate PCB

$90.68

Huanyuchang DSL230° high temperature resistant cushion pad shipped from the source factory for laminator PCB and ccl lamination

$90.68

DSL230° Navis high-temperature resistant pressure-bonding buffer pad for PCB copper-clad laminate CCL new energy IC carrier board

$90.68